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mpx5050 mpxv5050g series 1 sensor device data freescale semiconductor integrated silicon pressure sensor on- chip signal conditioned, temperature compensated and calibrated the mpx5050/mpxv5050g series piezoresisti ve transducer is a state--of--the--art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this patented, single element transducer combi nes advanced micromachining techniques, thin--film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? 2.5% maximum error over 0 to 85 c ? ideally suited for microprocessor o r microcontroller--based systems ? temperature compensated over -- 40 to +125 c ? patented silicon shear stress strain gauge ? durable epoxy unibody element ? easy--to--use chip carrier option figure 1. fully integrated pressure sensor schematic v s sensing element gnd thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v out pins 4, 5, and 6 are no connects for unibody device pins 1, 5, 6, 7, and 8 are no connects for small outline package device mpx5050 rev. 7, 10/2004 freescale semiconductor technical data ? freescale semiconductor, inc., 2004. all rights reserved. mpx5050 mpxv5050g series integrated pressure sensor 0to50kpa(0to7.25psi) 0.2 to 4.7 volts output pin number note:pins4,5,and6areinternal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. mpx5050d case 867 mpx5050dp case 867c 1 2 3 v out gnd v s 4 5 6 n/c n/c n/c mpx5050gp case 867b unibody package small outline package surface mount MPXV5050Dp case 1351 mpxv5050gp case 1369 pin number 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c 4v out 8n/c note:pins1,5,6,7,and8are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. freescale semiconductor preferred device
2 sensor device data freescale semiconductor mpx5050 mpxv5050g series maximum ratings (note) parametrics symbol value unit maximum pressure (p1 > p2) p max 200 kpa storage temperature t stg -- 4 0 to +125 c operating temperature t a -- 4 0 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s =5.0vdc,t a =25 c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 4 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) p op 0 ? 50 kpa supply voltage (2) v s 4.75 5.0 5.25 vdc supply current i o ? 7.0 10.0 madc minimum pressure offset (3) (0 to 85 c) @v s =5.0volts v off 0.088 0.20 0.313 vdc full scale output (4) (0 to 85 c) @v s =5.0volts v fso 4.587 4.70 4.813 vdc full scale span (5) (0 to 85 c) @v s =5.0volts v fss ? 4.50 ? vdc accuracy (6) ? ? ? ? 2.5 %v fss sensitivity v/p ? 90 ? mv/kpa response time (7) t r ? 1.0 ? ms output source current at full scale output i o + ? 0.1 ? madc warm--up time (8) ? ? 20 ? ms offset stability (9) ? ? ? 0.5 ? %v fss notes: 1. 1.0kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss at 25 c. 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. warm--up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 9. offset stability is the product?s output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams weight, basic element (case 1369) 1.5 grams
mpx5050 mpxv5050g series 3 sensor device data freescale semiconductor figure 3 illustrates the differential/gauge sensing chip in the basic chip carrier (case 867). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx5050/mpxv5050g series pressure sensor oper- ating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. me- dia, other than dry air, may have adverse effects on sensor performance and long--term reliability. contact the factory for information regarding media compatibility in your application. figure 2 shows the sensor output signal relative to pres- sure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 4 . the output will saturate outside of the specified pressure range. figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the a/d in- put of a microprocessor or microcontroller. proper decoup- ling of the power supply is recommended. figure 2. output versus pressure differential max differential pressure (kpa) 5.0 4.0 3.0 2.0 0 55 35 15 0 output (v) 45 25 4.5 3.5 2.5 1.5 5 transfer function: v out =v s *(0.018*p+0.04) error v s =5.0vdc temp = 0 to 85 c 1.0 0.5 50 30 10 40 20 min typical figure 3. cross--sectional diagram (not to scale) fluoro silicone gel die coat wire bond lead frame die stainless steel metal cover epoxy plastic case differential/gauge element die bond p1 p2 figure 4. recommended power supply decoupling and output filtering. for additional output filtering, please refer to application note an1646. 1.0 m f ips 470 pf output vs + 5v 0.01 m f gnd vout
4 sensor device data freescale semiconductor mpx5050 mpxv5050g series nominal transfer value: v out =v s (p x 0.018 + 0.04) +/-- (pressure error x temp. factor x 0.018 x v s ) v s =5.0v 0.25 vdc transfer function 0.0 -- 4 0 -- 2 0 0 2 0 4 0 6 0 140 120 100 80 temperature error band -- 4 0 3 0to85 1 +125 3 temperature in c 4.0 3.0 2.0 1.0 mpx5050/mpxv5050g series temp multiplier temperature error factor note: the temperature multiplier is a linear response from 0 to --40 c and from 85 to 125 c. pressure error band error limits for pressure pressure (in kpa) 3.0 2.0 1.0 -- 1 . 0 -- 2 . 0 -- 3 . 0 0.0 0 10 20304050 60 pressure error (kpa) pressure error (max) 0to50kpa 1.25 kpa
mpx5050 mpxv5050g series 5 sensor device data freescale semiconductor pressure (p1) / vacuum (p2) side identification table freescale semiconductor designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluo- rosilicone gel which protects the die from harsh media. the freescale semiconductor mpx pressure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier mpx5050d 867 stainless steel cap mpx5050dp 867c side with part marking mpx5050gp 867b side with port attached mpxv5050gp 1369 side with port attached MPXV5050Dp 1351 side with part marking ordering information ? unibody package (mpx5050 series) mpx series device type options case type order number device marking basic element differential 867 mpx5050d mpx5050d ported elements differential dual ports 867c mpx5050dp mpx5050dp gauge 867b mpx5050gp mpx5050gp ordering information ? small outline package (mpxv5050g series) device type options case no. mpx series order no. packing options marking ported elements side port 1369 mpxv5050gp trays mpxv5050g dual port 1351 MPXV5050Dp trays mpxv5050g
6 sensor device data freescale semiconductor mpx5050 mpxv5050g series package dimensions unibody package basic element case 867--08 issue n style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex pin 1 f g n l r c b m j s notes: 10. dimensioning and tolerancing per ansi y14.5m, 1982. 11. controlling dimension: inch. 12. dimension --a-- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). -- a -- 123456 6pl d seating plane -- t -- m a m 0.136 (0.005) t dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30 nom 30 nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 s 0.090 0.105 2.29 2.66 __ style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. --vout 6. open style 2: pin 1. open 2. ground 3. --vout 4. vsupply 5. +vout 6. open positive pressure (p1) pressure side ported (ap, gp) case 867b--04 issue f style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex seating plane r n c j pin 1 m q m 0.25 t b 6x d g f s k v s p m 0.173 q s t l u a 1 2 34 5 6 notes: 1. dimensions are in millimeters. 2. dimensions and tolerances per asme y14.5m, 1994. dim min max millimeters a 29.08 29.85 b 17.4 18.16 c 7.75 8.26 d 0.68 0.84 f 1.22 1.63 g 2.54 bsc j 0.36 0.41 k 17.65 18.42 l 7.37 7.62 n 10.67 11.18 p 3.89 4.04 q 3.89 4.04 r 5.84 6.35 s 5.59 6.1 u 23.11 bsc v 4.62 4.93 t p p q q
mpx5050 mpxv5050g series 7 sensor device data freescale semiconductor package dimensions--continued unibody package pressure and vacuum sides ported (dp) case 867c--05 issue f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex r x 123456 dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.182 0.194 4.62 4.93 w 0.310 0.330 7.87 8.38 x 0.248 0.278 6.30 7.06 port #2 vacuum (p2) port #1 positive port #1 pin 1 port #2 positive vacuum pressure seating plane seating plane -- t -- -- t -- p g c j n b f d w v l u 6pl s k -- q -- -- a -- m q m 0.25 (0.010) t m a m 0.13 (0.005) pressure (p1) 0.220 0.240 5.59 6.10 (p1) (p2)
8 sensor device data freescale semiconductor mpx5050 mpxv5050g series small outline package dimensions surface mount case 1369--01 issue o d e e/2 n e a m 0.004 (0.1) b c a e1 a b c 0.004 (0.1) a 0.008 (0.20) b c 8x b 2 places 4 tips detail g seating plane 8x p 1 4 8 5 notes: 1. controlling dimension: inch. 2. interpret dimensions and tolerances per asme y14.5m--1994. 3. dimensions ?d? and ?e1? do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. 4. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. dim a min max min max millimeters 0.300 0.330 7.11 7.62 inches a1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 d 0.465 0.485 11.81 12.32 e e1 0.465 0.485 11.81 12.32 e m 0.270 0.290 6.86 7.36 n 0.080 0.090 2.03 2.28 p 0.009 0.011 0.23 0.28 t 0.115 0.125 2.92 3.17 0.100 bsc 2.54 bsc f 0.245 0.255 6.22 6.47 k 0.120 0.130 3.05 3.30 l 0.061 0.071 1.55 1.80 f k m gage detail g l a1 .014 (0.35) plane 0707 t ? 0.717 bsc 18.21 bsc
mpx5050 mpxv5050g series 9 sensor device data freescale semiconductor small outline package dimensions -- continued surface mount case 1351--01 issue o d e e/2 n e a m 0.004 (0.1) b c a e1 a b c 0.004 (0.1) a 0.006 (0.15) b c 8x b 2 places 4 tips detail g seating plane 8x p 1 4 8 5 notes: 1. controlling dimension: inch. 2. interpret dimensions and tolerances per asme y14.5m--1994. 3. dimensions ?d? and ?e1? do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. 4. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. dim a min max min max millimeters 0.370 0.390 9.39 9.91 inches a1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 d 0.465 0.485 11.81 12.32 e 0.680 0.700 17.27 17.78 e1 0.465 0.485 11.81 12.32 e m 0.270 0.290 6.86 7.37 n 0.160 0.180 4.06 4.57 p 0.009 0.011 0.23 0.28 t 0.110 0.130 2.79 3.30 0.100 bsc 2.54 bsc f 0.240 0.260 6.10 6.60 k 0.115 0.135 2.92 3.43 l 0.040 0.060 1.02 1.52 f k m t ? gage detail g l a1 .014 (0.35) plane 0707 style 1: pin 1. gnd 2. +vout 3. vs 4. --vout 5. n/c 6. n/c 7. n/c 8. n/c style 2: pin 1. n/c 2. vs 3. gnd 4. vout 5. n/c 6. n/c 7. n/c 8. n/c
10 sensor device data freescale semiconductor mpx5050 mpxv5050g series notes
mpx5050 mpxv5050g series 11 sensor device data freescale semiconductor notes
12 sensor device data freescale semiconductor mpx5050 mpxv5050g series information in this document is provided solely to enable system and software implementers to use freescale semiconductor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products fo r any particular purpose, nor does freescale semiconductor assume any liability arising out of t he application or use of any product or circuit, and specifically disclaims any and all liabilit y, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale semiconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemnify and hold freescale semiconductor and its officers, employees, subsid iaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale t and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2004. all rights reserved. how to reach us: home page: www.freescale.com e--mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1--800--521--6274 or +1--480--768--2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33169354848(french) support@freescale.com japan: freescale semiconductor japan ltd. technical information center 3--20--1, minami--azabu, minato--ku tokyo 106--0047, japan 0120 191014 or +81 3 3440 3569 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center p.o. box 5405 denver, colorado 80217 1--800--441--2447 or 303--675--2140 fax: 303--675--2150 ldcforfreescalesemiconductor@hibbertgroup.com mpx5050 rev. 7 10/2004

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